Odisha approves Rs 452 Cr integrated power electronics hub at IIT Bhubaneswar
Chief Minister Mohan Charan Majhi said the project will be jointly funded by MeitY, the Odisha government, Anusandhan National Research Foundation, and industry partners.
Odisha has approved a Rs 452-crore National Industry Co-Development Hub on Integrated Power Electronics at IIT Bhubaneswar, Chief Minister Mohan Charan Majhi said at SEMICON India 2026 in New Delhi on Friday.
The project will be developed under the Indian Design, Semiconductors, Packaging and Systems programme and jointly funded by the Ministry of Electronics and Information Technology, the Odisha government, the Anusandhan National Research Foundation, and industry partners.
According to Majhi, the programme will set up industry-led centres of excellence aimed at taking research and innovation closer to commercial use.
Odisha has so far approved five semiconductor manufacturing projects with a cumulative investment of Rs 10,899 crore. The projects are expected to generate more than 4,500 direct jobs and over 16,000 indirect jobs.
They cover silicon carbide semiconductors, advanced packaging, glass-substrate packaging, memory module assembly and power electronics.
Two of the projects have been approved under the India Semiconductor Mission.
SiCSem, an integrated device manufacturer, is setting up a silicon carbide semiconductor fab with packaging facilities, while Heterogeneous Integration Packaging Solutions, or HIPS/3DGS, is setting up an advanced glass-substrate packaging facility. The latter is aimed at applications in areas such as artificial intelligence, high-performance computing and advanced processors.
Other investments include RIR Power Electronics for Silicon Carbide power devices, Sancode Technologies for advanced packaging, and ASP Semicon for memory module OSAT operations.
Majhi said RIR Power Electronics has completed the erection and installation of silicon carbide epitaxial wafer manufacturing reactors at its Bhubaneswar facility and is expected to begin commercial production soon.
More projects in discussion
Odisha is also in talks for additional semiconductor investments.
The state is working to convert an Intel-3DGS memorandum of understanding into an investment in advanced glass substrates and packaging. Sancode is in discussions for a second-phase advanced packaging facility.
SiCSem is exploring a second phase involving a combined silicon carbide and gallium nitride fab and packaging facility, while QuadQuantum is exploring a silicon carbide wafer raw-material facility.
Odisha’s SEMICON India presentation puts its semiconductor investment pipeline at about $4.7 billion, including $1.2 billion of present investments and $3.5 billion of upcoming investments.
25% capex support for ISM projects
Majhi also highlighted Odisha’s semiconductor incentives. The state will provide additional fiscal support of up to 25% of eligible capital expenditure for projects approved under the India Semiconductor Mission.
The support also covers semiconductor equipment manufacturing, semiconductor-grade chemicals, gases, materials and other parts of the supply chain.
The state’s investment presentation also lists 30% capex support for certain non-ISM fabs and ATMP/OSAT projects and 10% for non-ISM raw material supply-chain projects.
Odisha’s semiconductor policy now covers design, equipment, raw materials, chemicals and gases, fabrication, ATMP/OSAT and research and development.
Majhi said the state was aiming to create semiconductor clusters rather than bring in standalone projects.
“A facility of this kind pulls an entire supply chain behind it,” he said.
Image credit: Odisha government (https://cm.odisha.gov.in)