SEMICON India sees flurry of MoUs as chip supply chain expands

India’s semiconductor push moved further from project approvals towards commercial production on Thursday, even as companies announced a series of partnerships at SEMICON India 2026 spanning chip manufacturing, packaging, materials, design infrastructure and workforce development.

The announcements came as CDIL Semiconductor’s facility in Mohali and Suchi Semicon’s unit in Palsana, Gujarat, began commercial production. Prime Minister Narendra Modi marked the start of production at the two facilities during the opening day of the event.

A series of memoranda of understanding and industry collaborations unveiled during the day reflected India’s attempt to build the layers around semiconductor manufacturing, from critical materials and equipment to packaging, suppliers, chip design and talent.

Tata Electronics was among the most active companies, with CEO Randhir Thakur saying the company would sign 16 MoUs with domestic and international partners at SEMICON India 2026. The agreements span companies from Europe, Japan, Malaysia, Singapore, India and other markets.

Tata Electronics expands around Dholera, Assam

Tata Electronics and Nexperia announced a strategic partnership spanning semiconductor manufacturing, packaging, technology and research.

Under the partnership, parts of Nexperia’s semiconductor portfolio are expected to be manufactured at Tata Electronics’ upcoming fab in Dholera, Gujarat, while discrete products will be packaged at its semiconductor assembly and test facility in Jagiroad, Assam.

The companies also plan to collaborate on research, technology and related supply-chain development.

Tata Electronics also partnered with Ascendas Firstspace to develop a 363-acre vendor park in Dholera, aimed at creating plug-and-play infrastructure for companies supplying the semiconductor industry.

Ascendas Firstspace will lead development of the park, while Tata Electronics will provide industry requirements and facilitate supplier engagement.

The company separately announced a collaboration with Japan’s JSR Corporation around critical semiconductor materials, including photoresists and functional chemicals. The partnership will also explore technical support, warehousing and future localisation in India.

Another collaboration, with the Semiconductor Laboratory, will focus on semiconductor research and manufacturing across critical technology areas, while supporting chip-design services, supply-chain localisation and workforce development.

Tata Electronics also tied up with Gati Shakti Vishwavidyalaya to develop industry-ready talent for semiconductor facility engineering and infrastructure.

Supported by L&T EduTech and Jacobs Solutions, the initiative will focus on curriculum development, certification and training in areas including clean-room construction and semiconductor manufacturing.

The broader list of Tata Electronics partners includes Nexperia and BESI from Europe; JSR, Fujifilm, Sumitomo and Sojitz from Japan; Ascendas Firstspace from Singapore; and L&T Semiconductors, Inox Air Products, Semiconductor Laboratory and Gati Shakti Vishwavidyalaya from India.

From Indian chip design to domestic packaging

The announcements also highlighted efforts to connect chip design in India with domestic manufacturing and packaging capabilities.

Suchi Semicon announced the successful packaging of an India-designed chip aimed at industrial and automotive applications, including battery-management systems, power-supply switching, LED lighting, HVAC and home-control systems.

The announcement coincided with the start of commercial production at Suchi Semicon’s OSAT facility in Palsana. CDIL Semiconductor also commenced production at its Mohali facility on Thursday.

Separately, Sensesemi Technologies and Quest Global announced a collaboration to integrate an India-designed sensor chip into next-generation smart-metering solutions aimed at markets across India, South Asia and Europe.

CDIL Semiconductors and Japan’s Shinjin Electronic Manufacturing Company also announced an association to develop the TO-247 power discrete package using assembly and packaging technology developed at CDIL’s ATMP facility in Mohali.

Intel, ISM focus on semiconductor skills

The India Semiconductor Mission and Intel India also launched an introductory semiconductor course aimed at students, educators, professionals, entrepreneurs and policymakers.

The programme will be available in 23 Indian languages and more than 240 languages globally, with the aim of widening access to foundational semiconductor knowledge.

Intel and the National Informatics Centre also announced an MoU focused on developing skills and capabilities in artificial intelligence and semiconductor technologies.

The government separately announced six regional centres under its ChipIN initiative to widen access to advanced chip-design infrastructure.

The centres will provide academic institutions, researchers, startups and innovators access to industry-grade electronic design automation tools, fabrication services, compute infrastructure, training and technical support.

The ChipIN Centre has already provided access to these resources to more than one lakh engineers from around 500 organisations, according to the announcement.

The regional centres are intended to take those capabilities closer to institutions across the north, south, east, west, central and northeastern parts of the country.

Semicon 2.0 broadens the push

The series of agreements comes as the government begins implementing Semicon 2.0, which was approved in July with an outlay of ₹1,27,500 crore.

The programme has six focus areas: chip design, machines and materials, new fabs, advanced packaging, research and development, and talent.

Electronics and IT Minister Ashwini Vaishnaw said during the event that the first phase of India’s semiconductor programme was largely about laying the foundation, while the second would focus more heavily on putting the supporting supply chain in place.

The government plans to scale support for semiconductor design companies, including startups, through funding, tooling, intellectual-property support, deployment assistance and help in finding customers.

It is also targeting at least 200 chip-design companies and startups and the training of more than one lakh semiconductor technicians and manufacturing workers under Semicon 2.0.

Modi, meanwhile, urged fabless semiconductor companies to build and retain intellectual property in India, while calling on equipment manufacturers and suppliers of chemicals and industrial gases to expand their presence in the country.

The flurry of agreements underlines the next challenge for India’s semiconductor ambitions. Attracting fabs and packaging plants is only one part of the equation. Building a competitive domestic industry will also depend on whether India can develop the materials, equipment, suppliers, design capabilities and skilled workforce needed to support those factories at scale.