MietY adds two more MSMEs to its SemiconIndia futureDESIGN DLI scheme
This DLI scheme provides financial incentives and design infrastructure support for various stages of semiconductor design.
The Ministry of Electronics and IT (MietY) recently included two more semiconductor design startups/MSMEs—Aheesa Digital Innovations and Calligo Technologies—in the SemiconIndia futureDESIGN Design Linked Incentive (DLI) scheme, it announced at the SemiconIndia 2023 conference in Gandhinagar on July 29.
The DLI scheme provides financial incentives and design infrastructure support for various stages of semiconductor designs, including Integrated Circuits, Chipsets, SoCs, Systems and IP cores, and semiconductor-linked designs.
Chennai-based Aheesa Digital Innovations focuses on telecom, networking, and cybersecurity. It plans to develop the Aheesa Vihaan series of networking SoCs (Systems on Chips) under the scheme.
The first version of Aheesa Vihaan will use the VEGA Processor Core—an indigenous processor series developed by the Center for Development and Advanced Computing.
Calligo Technologies, headquartered in Bengaluru, specialises in high-performance computing (HPC), big data, artificial intelligence, and machine learning. It will work on an accelerator product using a new number system called POSITs, which will be integrated into Digital India's RISC-V Processor (DIR-V).
Earlier this year, MeitY had already announced the names of five other startups/MSMEs during the DLI Roadshows in Bengaluru and Delhi. With the addition of Aheesa Digital Innovations and Calligo Technologies, the total number of beneficiaries under the scheme now stands at seven.
Edited by Suman Singh
