Spice launches the ‘& Series’ of Connected Spice Life Devices powered by Qualcomm chipsets

20th Aug 2010
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In line with its vision to provide cutting edge, technology products and services that enable new age mobility consumers to stay one step ahead of their dreams, Spice Mobility announces a new range of devices termed “Connected Spice Life” operating on the AndroidTM platform, and powered by chipsets from Qualcomm Incorporated, the world leader in next generation mobile technologies.

Three distinctive Connected Spice Life devices were unveiled today, which follow closely on the heels of a global launch in ASEAN countries. First of the series, Mi-300 boasts a 3.2” high resolution HVGA screen and will be closely followed by the launch of two other devices. Mi-410 a HD (High Def) mini-tablet with a 4.1” screen and the Mi-700 Mobile Internet tablet with a 7” screen. The Mi-410 and Mi-700 will debut around Oct- Nov this year.

 

The Spice Mi-300 is a 3.5G AndroidTM v2.1 ready device, with integrated Spice mobility offerings including a bouquet of customised applications developed by Spice Digital. The phone features a 3.2” HVGA Capacitive touch screen with a resolution of 320 x 240 pixels. Apart from being exceptionally user friendly it has applications including GMS & MS Office, GPS & A-GPS for location tracking or turn-by-turn directions, WI-FI, Push E-mail, G-sensor, E-compass, Proximity Sensor and more than 1,00,000 downloadable applications that can even convert your device into a metal detector. It comes with a 5MP Camera, Proximity sensor and all SNS applications, and is powered by the MSM7227™ chipset from Qualcomm.

The Mi-300 is exclusively available across 200+ Spice HotSpot outlets across the top metros and cities across the country from today, giving Spice Mobility customers a complete Connected Spice Life experience, The Mi-300 comes to customers at an attractive introductory price point of Rs. 9990.

The superbly designed Mi-410 Ver. 2.1 impresses most with its High Definition video record and play capability on a large 4.1” HVGA capacitive display. This Wi-Fi enabled device also has 3G (HSDPA), Bluetooth 3.0 + EDR transferring data at blazing speeds of 24Mbps, AGPS, GMS & MS office to satisfy advanced connectivity needs, and is powered by the Snapdragon MSM8255™ chipset from Qualcomm.

The Mi-700 Ver. 2.2 has a spectacular 7” HVGA touch screen. This handheld tablet has perfectly balanced virtues of both a mobile and an internet device connecting over Wi-fi, Bluetooth and 2G/ 3G. The high-resolution 7” screen is remarkably crisp and vivid. Which makes it perfect for web browsing, watching movies, or viewing photos. It’s designed to show off your content in portrait or landscape orientation with every turn. Add to that a hot swap memory card slot, USB data interfaces and Dual camera for video calling, which are absent in even popular tablets currently in the market. The Mi-700 is based on the MSM7227™ chipset from Qualcomm.

The launch of these 3G AndroidTM 2.1 ready devices, places Spice Mobility in good stead in the android devices market for the global and domestic consumers.

Expressing his pleasure at the Spice Mobility conference, Mr. Dilip Modi, Managing Director, Spice Mobility Ltd. said,” The launch of the Connected Spice Life devices with the ‘& Series’ (Android) range is in line with our vision and strategic thought of providing customers new age high technology devices that have an interplay on the Mobile Internet Platform readily operable in the 3G and HSPA. Our devices will have pre-embedded content and applications developed by Spice Digital, our VAS business and Spice Labs, our Mobile Internet & Apps business, retailed exclusively through Spice HotSpot stores across India to begin with, so as to offer an integrated mobility experience.

“We are also very pleased to have the opportunity to once again work with Qualcomm in moving to a new continuum of Mobile Internet, 3G and HSPA technologies and providing Mobility consumers enriched experience.” Mr. Modi added.

Present on the occasion Mr. Kanwalinder Singh, president of Qualcomm India and South Asia and senior vice president of Qualcomm said, "We are pleased to collaborate with Spice for the launch of 3G HSPA smartphones and tablets that leverage our Android leadership and are powered by Qualcomm’s SnapdragonTM platform and our MSM7xxx series chipset. 3G devices like these will go a long way in realizing our vision of enabling mobile internet for all Indians. We are committed to 3G success of Indian brands like Spice and causing a fundamental shift in the internet and computing experience for Indian consumers.”

About Spice Mobility

Spice Mobility has been shaped out of the amalgamation of Spice Mobile, Spice Retail, Spice Digital and Spice Labs to create a singular entity, announced earlier this year in January 2010. The amalgamation process is underway and is expected to be completed in Q3 FY10-11. Spice Mobility is listed on the BSE (Scrip Code- 517214) and on NSE (Scrip Code – SPICEMOBIL)

Spice Mobile, the mobile devices business of Spice Mobility is one of the leading device makers in India, with substantial global presence in markets in Nepal, Bangladesh, Sri Lanka, Malaysia, Indonesia and Africa. It is looking to further enhance its presence across other SAARC, ASEAN and Middle East markets.

Known for its long history of pioneering firsts for the Indian market, Spice has launched many cutting edge products including the first Dual SIM Phone, the First Flexi-Dual SIM phone (swapping between GSM and CDMA SIMs), the first Dual Memory Slot phone, the first 12MP camera phone with a CCD Sensor and 3x optical zoom. It has also launched global firsts including the first mini-DVD movie phone and the People’s phone (without screen) with a Braille version. It has been awarded and recognized globally for its pioneering work.

Qualcomm is a registered trademark of Qualcomm Incorporated. MSM7227, MSM8255 and Snapdragon are trademarks of Qualcomm Incorporated.

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